Products-Equipment
Provide inspection devices for conducting and short-circuit insulation (OPEN/LEAK) testing of semiconductor packages such as MCM, CSP, and BGA, as well as solder ball flattening devices for semiconductor packages such as FC-BGA/CSP.
Provides a variety of detection devices that can perform OPEN/LEAK tests on various circuit boards such as motherboards, and can respond flexibly according to the type, size and number of detection points of the detection object.
